Wi-Fi & Bluetooth smart module
Android 10 / Android 13* / Ubuntu 18.04
64 GB UFS + 8 GB LPDDR5
Quectel of the brand in the industrial and consumer-oriented IoT applications sg865w product designed for high-performance Wi-Fi and Bluetooth modules. QCS8250 IoT chipset is built on this module, 8 core cryo-585 CPU and Adreno 650 GPU with 10 works with the Android operating system, while providing powerful computing capacity. SG865W from compact LGA package, with IP54 dust and splash proof sealing properties. Located in sg865w module, Wi-Fi 6, Bluetooth 5.1 2x2 MIMO technology and high-speed wireless connections allow. LCM, camera, touch panel, I2S, PCI, UART, USB, I2C, SPI interfaces, which have SG865W like the video conference system has a wide application area of robotic applications.
SG865W, IoT and AIoT applications with high computing power and multimedia capabilities, which gives a link module. QCS8250 developed by Qualcomm chipset built on SG865W, 8K@30fps video encoding, 8K@60fps video decoding and 64 MP camera support. Thanks to the built-in memory, high-speed data processing and data module, which has the advantage of smart storage, Wi-Fi, offering speeds of 6 Gbps 1.2 5.1 Bluetooth technology while technology is a short-range connections and provides access to up to 100 meters. On the other hand, similar to the functionality separated from SG865W, the 5G or LTE ec20 Quectel rg500q modules integrated with 4G/5G network can be connected.
SG865W technical features, thanks to the IoT module is ideal for applications. 7nm technology with high computing power and rich interfaces in the module is produced by cryo striking eight-core CPU along with Adreno 650 GPU is located in the 585. The CPU and the GPU in question, as well as LPDDR5 RAM and 64 GB of UFS storage is located in the module 8 GB; 15 until the tops of computing power, 8K@30fps encoding, 8K@60fps up to 64 MP cameras solving and provide support. Working voltage: 3.3-4.3 V power consumption sleep of the module 10 mA, 1.5 in active mode A@3.8V much it. 25°C to +75°C show high performance in varying conditions of heat, which will SG865W, thanks to protection class IP54 dust and splash resistant. There are also ESD protection module.
40.5 x 40.5 mm x 2.85 because it comes in a compact LGA package measuring only 12 grams of the total weight of the product sg865w. Dimensions and weight due to space constraints easily with the certificates that are available for projects with module is similar. CE, ROHS and REACH compliant sg865w which interfaces with the flexible use supports. 2x LCM (WSXGA+ screen), 4x MIPI-CSI (camera), 1x touch panel, 1x MIC, 1x I2S (voice), 2x PCIe, 3x UART, 2x USB (2.0/3.0), 2x I2C, 1x SPI, 4x PWM interface and thanks to the module different from each other in projects that are cost-free to use as it is possible. Attention SG865W properties between 3GPP Release 14 compatibility. Module is optimized for Edge computing, reliable, versatile, flexible and high-performance.
High computing power, AI, featured with sg865w performance and multimedia capabilities, IoT and AIoT applications. The main application areas of video conferencing systems module, cloud gaming platforms, digital signage, Smart Robots, Smart Retail, Smart Security Systems, live broadcast devices, AR/VR devices, unmanned aerial vehicles, smart home systems, portable medical devices, industrial automation systems and it is possible to order. SG865W use and related examples include:
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